Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes

<table class="table-group" id="tab9"><tr><td><table class="table"><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr class="thead"><td class="align_left">Samples</td><td class="align_center">OCP</td></tr><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr><td class="align_left">Unrolled nor heated (Cu-1)</td><td class="align_center">−0.19442</td></tr><tr><td class="align_left">1<sup>st</sup> pass heated (Cu-2)</td><td class="align_center">−0.07237</td></tr><tr><td class="align_left">2<sup>nd</sup> pass heated (Cu-3)</td><td class="align_center">−0.32645</td></tr><tr><td class="align_left">1<sup>st</sup> pass unheated (Cu-4)</td><td class="align_center">−0.127045</td></tr><tr><td class="align_left">2<sup>nd</sup> pass unheated (Cu-5)</td><td class="align_center">−0.10937</td></tr><tr class="table-tr"><td colspan="2"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>Open circuit potential (OCP) values of copper samples during ARB and the parent sample.</div>

Journal of Engineering

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Table 9

Table 9: Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes 

Table 9 | Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes 