Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes

Figure 4

Optical microscope micrographs of unheated samples at 277X: (a) 1^st ARB pass (Cu-4) and (b) 2^nd ARB pass (Cu-5).

(a)

(b)