Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate
Figure 4
SEM images of (a) Cu and (b) Pd electrodeposited on BDD electrode. Both were deposited by 120 s, and −0.3 V and 0.2 V were applied to deposit Cu and Pd, respectively.
