Morphology of Near- and Semispherical Melted Chips after the Grinding Processes Using Sol-Gel Abrasives Based on SEM-Imaging and Analysis

<table class="table-group" id="tab3"><tr><td><table class="table"><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr class="thead"><td class="align_left">Chemical<br/>element</td><td class="align_center">Percentage of elements, %</td></tr><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr><td class="align_left">Ti</td><td class="align_center">Balance</td></tr><tr><td class="align_left">Fe</td><td class="align_center">0.06</td></tr><tr><td class="align_left">N</td><td class="align_center">0.009</td></tr><tr><td class="align_left">O</td><td class="align_center">0.09</td></tr><tr><td class="align_left">H</td><td class="align_center">0.006</td></tr><tr><td class="align_left">C</td><td class="align_center">0.02</td></tr><tr class="table-tr"><td colspan="2"><hr class="tbody-hr"/></td></tr></table></td></tr><tr class="table-fn"><td><svg height="12.308pt" id="M28" style="vertical-align:-0.04979992pt" version="1.1" viewbox="-0.0498162 -12.2582 11.5861 12.308" width="11.5861pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.0091,0,0,-0.0091,0,-5.741)"><path d="M309 -142C211 -61 151 99 151 271S210 601 309 683L288 710C141 611 75 451 75 272V271C75 90 141 -72 288 -169L309 -142Z" id="g50-41"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="358" vert-adv-y="358"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,3.258,-5.741)"><path d="M389 0V32C297 38 291 46 291 118V635C234 613 175 595 109 583V556L161 554C203 552 207 547 207 497V118C207 46 201 38 110 32V0H389Z" id="g50-50"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,7.689,-5.741)"><path d="M283 271C283 451 220 610 70 710L48 683C146 603 207 443 207 271S149 -59 48 -142L70 -169C220 -67 283 90 283 271Z" id="g50-42"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="358" vert-adv-y="358"></glyph.data></g></svg>Material is produced by Shanghai HeHe International Trading CO., LTD (Shanghai, China) and distributed by Bibus Metals (Fehraltorf, Switzerland).<br/></td></tr></table>

Chemical composition and percentage of elements of Titanium Grade® 2 alloy<svg height="12.308pt" id="M27" style="vertical-align:-0.04979992pt" version="1.1" viewbox="-0.0498162 -12.2582 11.5861 12.308" width="11.5861pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.0091,0,0,-0.0091,0,-5.741)"><path d="M309 -142C211 -61 151 99 151 271S210 601 309 683L288 710C141 611 75 451 75 272V271C75 90 141 -72 288 -169L309 -142Z" id="g50-41"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="358" vert-adv-y="358"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,3.258,-5.741)"><path d="M389 0V32C297 38 291 46 291 118V635C234 613 175 595 109 583V556L161 554C203 552 207 547 207 497V118C207 46 201 38 110 32V0H389Z" id="g50-50"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,7.689,-5.741)"><path d="M283 271C283 451 220 610 70 710L48 683C146 603 207 443 207 271S149 -59 48 -142L70 -169C220 -67 283 90 283 271Z" id="g50-42"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="358" vert-adv-y="358"></glyph.data></g></svg>.

Advances in Materials Science and Engineering

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Table 3

Table 3: Morphology of Near- and Semispherical Melted Chips after the Grinding Processes Using Sol-Gel Abrasives Based on SEM-Imaging and Analysis 