Morphology of Near- and Semispherical Melted Chips after the Grinding Processes Using Sol-Gel Abrasives Based on SEM-Imaging and Analysis

Figure 4

General morphology of single near-spherical melted chips formed after internal cylindrical reciprocal grinding of 100Cr6 steel obtained by use of scanning electron microscope JSM-550LV produced by JEOL: (a) SEM micrograph (size: 209.52 × 128.57 μm, mag. 800×) of GWAS 1–35 × 20 × 10-SG/F46K7VTO, showing size comparison between large size single shearing-type chip and typical single near-spherical melted chip, (b) SEM micrograph (size: 293 × 180 μm, mag. 500×) of GWAS 1–35 × 20 × 10-SG/F46K7VTO, showing the situation, when, on this same GWAS, single near-spherical melted chip and cluster of near-spherical melted chips were formed, (c) AOI (size: 48.38 × 48.38 μm, mag. 2100×) extracted from (b) with single near-spherical melted chip, and (d) AOI (size: 48.38 × 48.38 μm, mag. 4200×) extracted from (b) with cluster of near-spherical melted chips. Note: Acc. voltage, accelerating voltage; BES, backscattered electron (shadow image); WD, working distance.