Significant effects of defects on materials properties motivate research in a tremendously broadened variety of materials. Defects in materials could deteriorate properties and degrade their performance, while they could also be extremely useful to generate novel and innovative materials and devices with desirable properties. Understanding of the mechanism for defect formation, evolution, and interactions and its role in the structural, electronic, optical, and magnetic properties of bulk, thin film and nanoscale materials, thus, gain preeminent relevance to the prospect of superior performance. To promote ongoing international research and information exchange through publication of latest research reports/breakthroughs, we call for papers on defects in solid- state physics, which will focus on research into point and extended defects, dopants, shallow, and deep impurities in low-dimensional and nanoscale structures and oxide layers under both ambient and extreme conditions (irradiation, high temperature, high pressure, etc.).

We invite both theoretical and experimental researchers to contribute original research papers and review articles that meet the general criteria of significance and scientific excellence. Potential topics include, but not limited to:

• Physics of various defects in semiconductors and ceramics: origin and properties
• Effects of defects on electronic, magnetic, optical, thermal, and mechanical properties of bulk and film materials, surface, and interfaces
• Thermal and chemical stability of various defects under strain and extreme environments
• Computational simulation of defects generation and dynamics for growth- and processing-induced defects
• Determination and quantification of point and extended defects by advanced diffraction, spectroscopy, and imaging techniques

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/acmp/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/acmp/dssp/ according to the following timetable: