Review Article
Progress in ZnO Acceptor Doping: What Is the Best Strategy?
Table 1
Summary of room temperature Hall data for p-type ZnO.
| Growth technique | Structurea | Acceptor doping scheme | Hole concentration (1018 cm−3) | Mobility (cm2 V−1 s−1) | Resistivity (-cm) | Reference |
| CVD | U | NH3 and excess Zn | 0.015 | 12 | 34 |
Minegishi et al. [19] | MBE | SC | RF plasma N2 | 0.09 | 2 | 40 | Look et al. [20] | RF diode sputtering | SC | Ga, N codoping | 0.09 | 6 | 11.77 | Singh et al. [21] | MBE (ECR O source) | U | Sb-doped + 800°C anneal | 1.7 | 20 | 0.2 | Xiu et al. [22] | DC reactive magnetron sputtering | PCb | Li-doped | 0.14 | 2.65 | 16.4 | Zeng et al. [23] | RF magnetron sputtering | SC | Ga and N codoping (N2 sputtering gas) | 0.39 | 0.4 | 38 | Kumar et al. [24] | Plasma assisted MOVPE | U | NO plasma as O and N source | 2.29 | 1.59 | 1.72 | Zeng et al. [25] | Sol-gel | PC | Al and N codoping + O anneal | 0.08–0.2 | 1.6–1.73 | 19–45 | Dutta et al. [26] | RF magnetron sputtering | SC | O and As dual implantation | 6.8–19.8 | 19–32.9 | 0.05–0.55 | Kim et al. [27] | MOVPE | U | P-doped | 0.21 | 1.2 | — | Du et al. [28] | PLD | PC | Na-doped + 254 nm illumination | 0.21 | 7.9 | 3.8 | Lin [29] | PLD | SC | N+ implantation + dynamic annealing | 0.024–0.52 | 0.7–3.71 | 18–71 | Myers et al. [30] | Plasma assisted MBE | U | Sb-doped + 800oC anneal | 0.06 | — | — | Huang et al. [31] | MOVPE | SC | As-doped via outdiffusion | 0.35 | 0.79 | — | Shi et al. [32] | Magnetron sputtering | U | P and N codoping + 800°C anneal | 1.16 | 1.35 | 3.98 | Sui et al. [33] | Plasma assisted MBE | SC | Na doping | 0.002 | 0.4 | 8575 | Ding et al. [34] | Spin coating | PC | N, Al codoping + double anneal in NH3 and N2 | 0.61 | 198.8 | 0.05 | Kalyanaranan et al. [35] | MOVPE | SC | 3% NO in N2 | 3.6 | 0.4 | 4.4 | Reynolds et al. [36] |
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U: undefined; SC: single crystal; PC: polycrystalline. All are thin films.
b(002) preferential orientation.
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