Mechanism of Alkali-Activated Copper-Nickel Slag Material

Figure 10

SEM micrographs of the copper-nickel slag and CNSCMs cured for 28 (d). (a, b) Copper-nickel slag cementing materials cured with 70% humidity and (c, d) copper-nickel slag cementing materials cured with 40% humidity.

(a)

(b)

(c)

(d)